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Etch

  

Plasma Pod Basic

 

   

New for 2010 the Plasma Pod offers customers a benchtop plasma etching system.

The Plasma Pod is equipped with up to 3 gas lines, 300 watt RF generator, automatic matching unit, turbo molecular pump , automatic pressure control and full PLC control unit with touch screen interface.

System dimensions are 560 mm x 390 mm x 620 mm.

The system has an aluminium chamber with a water cooled electrode which can accept up to a 125 mm diameter substrate.

 

  
  
Datasheet 

Mini-Lab Plasma Pod Basic Flyer.pdf
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Plasma Pod TRI

  
  
  
 

  

 

 

 

The TRI-Pod is the only benchtop plasma system capable of running plasma etch (PE), reactive ion etch (RIE) and plasma enhanced chemical vapor deposition (PECVD) processes in a single reaction chamber. The system is the same size as the Pod Plus with a foot print of less than 20 x 20 inches. The advanced control system allows users to switch between these process quickly and easily. All this capability is available from one low price. For more information on the TRI-Pod please read the following brochures.

Datasheet Plasma TRI-Pod Sales Spec Kopie .pdf

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Etch

 



  

Prog200 Plasma Etching System

 

  
  
  
 

 

The PROG200 Etch system is a cost effective, reliable unit designed for use in R&D,
III-V processing and all types of training institutes. With a range of options with this tool such as RF sources, gas modules and vacuum arrangements this system provides a lot of customisation.

The system also comes with 1 year warranty, full spares support and the option for further service contracts.

Datasheet Prog200.pdf

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MPS 1200 Plasma Deposition or Etch System

 

  
  
  
 

 

 

 

The MPS 1200 system can be configured to run either deposition or etch applications.

Built in modular format, the systems can be easily configured to suit customers' requirements.

The system also comes with 1 year warranty, full spares support and the option for further service contracts.

Datasheet MPS 1200 Dual System flyer.pdf

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MPS 1400 Plasma Deposition or Etch System

 

  
  
  
 

 

 

The MPS 1400 system can be configured to run either deposition or etch applications.

Built in modular format, the systems can be easily configured to suit customers' requirements. The MPS 1400 is designed to accept either atmospheric or vacuum loadlocks.

The system also comes with 1 year warranty, full spares support and the option for further service contracts.

Datasheet MPS 1400 Dual Chamber Flyer.pdf

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Etch

 



  

MPS 1400 ICP Plasma Etch System

 

  
  
  
 

 

 

The MPS 1400 ICP system is configured with a 3Kw ICP source and a with a helium back cooled substrate electrode.

The system also comes with 1 year warranty, full spares support and the option for further service contracts.

Datasheet MPS 1400 ICP-E Spec Sheet Kopie .pdf

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Etch

 



  

MPS 1600 Plasma Deposition or Etch System

 

  
  
  
 

 

 

 

The MPS 1600 system can be configured to run either deposition or etch applications. The system houses an internal gas box, RF network and PLC controller.

The system also comes with 1 year warranty, full spares support and the option for further service contracts

Datasheet MPS1600.pdf

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Etch

 



  

MPS 2200 Plasma Deposition or Etch System

 

  
  
  
 

 

 

The Mini-Lab MPS 2200 is designed for large area deposition or etch processing. The system has a stainless steel chamber which houses a 500mm diameter electrode. The system can be supplied with a variety of RF sources and pumping arrangements.

The system also comes with 1 year warranty, full spares support and the option for further service contracts.

Datasheet MPS2200 System flyer.pdf

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Datasheet