Sputtering

Table of contents

• Sputtering deposition systems & sputtering equipment
• What is sputtering?
• When to choose sputtering deposition
• Sputtering overview 
• Step-by-step buying guide
• Typical applications for sputtering
• Why buy sputtering equipment from us

Sputtering deposition systems & sputtering equipment

TL;DR: A sputtering system ejects atoms from a target in a controlled plasma, then deposits a dense, uniform thin film on the substrate. It delivers tight uniformity, stable rates, and excellent adhesion at low to moderate temperatures. Use sputtering deposition when you need production-grade films on wafers, glass, metals, or polymers with repeatable results.

What is sputtering?

Sputtering is a physical vapor deposition process that accelerates ions in a low-pressure gas to knock target atoms into the gas phase, which then condenses on the substrate. It produces dense films with good step coverage and precise thickness control. Compared with evaporation, sputtered layers are usually denser and more uniform at similar temperature budgets.

Benefits in one look:  

• Dense films, excellent uniformity and adhesion 
• Low to moderate substrate temperature, suitable for polymers and wafers 
• Reactive runs for oxides and nitrides, multi-target stacks possible 
• Scales from R&D to 200/300 mm production with automation 

When to choose sputtering deposition?

Choose sputtering equipment if you need: 

• Uniform metallic or ceramic films with tight tolerances 
• Reactive oxides or nitrides such as SiOₓ, SiNₓ, TiN 
• Low-temperature processing with robust adhesion 
• High repeatability for optics, semiconductors, medtech and wear coatings 

Sputtering overview 

Sputtering is PVD with a plasma that ejects atoms from a target and deposits a dense, uniform thin film on the substrate. A sputtering system achieves high uniformity at low to moderate temperatures. It suits 200/300 mm wafers, glass, metals, and polymers. 

Overview table

Aspect	Answer
Process	Sputtering deposition with ion bombardment in vacuum
Core effect	Dense films, very good uniformity, strong adhesion
Temperature budget	Low to medium, heating available if needed
Typical materials	Metals, alloys, oxides and nitrides via reactive sputtering
Substrate sizes	Samples up to 200/300 mm plus parts with fixtures
Deposition rate	Medium to high, depends on source and target
Sources & power	DC or RF, optional magnetron multi-cathode
Process control	MFC gas delivery, pressure control, recipe control, QCM or optical monitoring
Automation	Load-lock, EFEM/FOUP, production data logging
Main uses	Optics and filters, semiconductors, medtech, wear coatings, energy

Advanced sputtering options

Option	Purpose	Result
Magnetron sputtering	Magnetic field increases plasma density	Higher rate, very dense films, lower pressure
Reactive sputtering	O₂ or N₂ to form compounds	Oxides and nitrides with controlled stoichiometry
Pulsed DC / RF	Stabilize insulating or arc-prone targets	Less arcing, smoother films
Substrate bias	Control ion energy at the substrate	Densification and stress tuning
Planetary motion	Optimize substrate path	Typical ±2–5% uniformity even on complex parts

Specification snapshot

Specification	Typical range
Base pressure	1×10⁻⁶ to 1×10⁻⁸ mbar, process at a few mTorr
Uniformity	±2–5% with suitable fixtures and motion
Temperature	Room temperature to about 400 °C depending on setup
Monitoring	QCM rate, ellipsometry, thickness mapping, SPC
Safety	Interlocks, exhaust, gas safety, CE depending on scope

Step-by-step buying guide

Step 1	Define substrate, size, and temperature limit.
Step 2	Set film stack and KPIs such as uniformity and stress.
Step 3	Pick source configuration, magnetron type, and power supplies.
Step 4	Specify gas panel and reactive control for oxides or nitrides.
Step 5	Choose fixtures and motion for coverage and repeatability.
Step 6	Decide on automation and metrology, then lock acceptance tests.

Typical applications for sputtering

Optical stacks via sputtering

Use sputtering deposition for dense, index-stable AR, HR and BBAR stacks with ±2–3% uniformity and low scatter. Typical sputtered films include TiO₂, SiOₓ/SiNₓ and ITO on glass or polymers. Validate with thickness maps and ellipsometry. Not ideal when fully conformal 3D coverage at very low temperature is mandatory. 

Wafer metallization and passivation by sputtering (200 mm and 300 mm)

Choose sputtering for seed, barrier and passivation with clean interfaces and repeatable runs. Common stacks are Ti/TiN, Al, Cu and SiNₓ/SiOₓ in reactive mode. The Production frame includes load lock, EFEM/FOUP, recipe control and SPC with a ±2–5% uniformity target and low particles. Prefer PECVD or ALD only when extreme conformality is the primary constraint. 

TiN sputter coatings for medical devices

Apply sputtering equipment for hard, clean and biocompatible films such as TiN or thin barrier layers at low to moderate temperatures. Verify with adhesion testing, contact angle and sterilization stability. Use hybrid routes when specific DLC chemistries are required. 

Magnetron sputter hardcoats for wear protection 

Magnetron sputtering deposits dense TiN, TiCN and CrN for tools and precision parts with low friction and high hardness. Tune fixtures and optional substrate bias to balance stress and coverage. Prove performance with tape or scratch tests and friction under load. 

Sputtered electrodes and barriers for energy and sensors

Select a sputtering system for conductive, catalytic and barrier layers in batteries, fuel cells, PV and sensing. Typical films include ITO or alternatives, Ni/Co and diffusion barriers. Focus on sheet resistance, optical transmission and scale-up from R&D to pilot lines. 

Why buy sputtering equipment from us

We size the sputtering system to your process and deliver the surrounding stack, from vacuum and gas delivery to handling and metrology. You receive full documentation and acceptance testing as defined in the project scope, plus ongoing service covering installation, preventive maintenance, repairs and upgrade programs. Our partner ecosystem spans thin-film systems, wafer handling, atmospheric plasma, wet processing (SRD), rapid thermal processing and metrology standards, ensuring compatible interfaces and predictable deployment.