Physical Vapor Deposition

Table of contents

• PVD coating systems
• What is physical vapor deposition? 
• Why choose PVD for your application?
• PVD process overview
• System portfolio & key specifications
• Application of PVD technology  
• PVD technologies we deliver

PVD coating systems 

Physical vapor deposition (PVD) is a vacuum-based coating process used to create high-quality thin films on wafers and precision components. With our dedicated PVD coating systems, we support customers in semiconductors, optics and advanced manufacturing who need stable processes, tight film uniformity and reliable adhesion. Novel Tec acts as an integration partner for PVD technology, combining process know-how, hardware and automation into complete solutions. We help you select and configure the right PVD deposition system for your substrate sizes, materials and throughput targets, and support you from first trials through to qualified production. 

What is physical vapor deposition? 

Physical vapor deposition transfers material from a solid source to a substrate in several controlled steps. Energy is applied to a target, atoms are knocked out or evaporated, move through a low-pressure gas and condense as a thin film on the surface. The process is mainly line-of-sight, which makes it well suited for precise, directional coatings. The core principles of a stable PVD process are constant vacuum conditions, controlled energy input and repeatable substrate handling. Key parameters include base pressure, process gas composition, power, substrate temperature and time. By adjusting these variables, engineers tailor film thickness, microstructure, stress, adhesion and electrical or optical properties. Compared to wet plating or painting, PVD uses solid sources and clean vacuum environments to achieve highly reproducible coatings with low contamination. 

Why choose PVD for your application?

Choosing PVD for your application gives you a combination of film quality, flexibility and process control that many other coating methods cannot offer: 

• High quality thin films: Achieve tight thickness and uniformity control on wafers and complex parts, with stable PVD processes that are easy to repeat and scale. 
• Wide material and stack options: Deposit metals, alloys and compounds in single layers or multilayer stacks using one PVD coating system, from barrier and seed layers to functional and decorative films. 
• Strong adhesion and durability: Combine proper surface preparation with optimised PVD treatment to get coatings that adhere well and withstand thermal, mechanical and chemical stress.  
• Clean, dry and production-friendly: Work in a vacuum with solid sources instead of wet chemistry, reducing contamination risks, waste handling and line complexity. 
• Scalable equipment concepts: Start with development tools and move to high-throughput PVD equipment using similar recipes, interfaces and automation. 

PVD process overview

The PVD process in production runs through a few repeatable steps: 

Step 1	Parts or wafers are loaded into the chamber or load lock, and the system is pumped down to the required base pressure.
Step 2	If needed, a pre-clean or plasma activation step prepares the surface for good adhesion.
Step 3	Process gases and power are set, the plasma or evaporation source is started, and the conditions in the chamber are stabilised.
Step 4	Material from the target is transferred through the vacuum and condenses as a thin film on the substrates until the programmed thickness is reached.
Step 5	The system cools if required, then vents and unloads the coated parts for inspection or the next process step.

System portfolio & key specifications

Our PVD coating systems are configured to match your process window rather than forcing you into a fixed product family. Each project starts from a proven platform and is adapted to wafer size, materials, throughput and integration level. The table below summarises the typical capability ranges and key parameters we can achieve with a customised PVD deposition system. 

Feature	Typical capability range	Configuration examples
Substrate handling	Wafers up to 300 mm, small parts, carriers & panels	Single wafers, batch carriers, frames, custom fixtures
Materials	Metals, alloys, nitrides, oxides, carbon-based layers	Al, Cu, Ti, TiN, Cr, Au, barrier/seed, DLC
PVD methods	Magnetron sputtering, co-sputtering, optional evaporation	DC/RF sputtering, reactive sputtering, multi-cathode setups
Chamber concept	Single or multi-chamber, with or without load-lock	Standalone process chamber, load-lock tool, cluster integration
Deposition rate	From sub-nm/min to several µm/hr	Optimised for uniformity, step coverage or throughput
Thickness uniformity	Down to ±1.5 % on supported wafer sizes	Recipe and hardware tuning for critical layers
Base pressure	High and ultra-high vacuum regimes	Typical process base pressure < 5 × 10^-7 mbar
Automation	Manual to fully automated	Cassette loaders, EFEM, vacuum wafer handler, factory interface
Cleanroom compatibility	Integration into ISO 6 to ISO 5 environments	Side-by-side with existing thin film and metrology tools

Application of PVD technology  

PVD technology is used across a wide range of high-tech industries, each relying on specific deposition methods to meet its performance and reliability targets. The table below gives an overview of key sectors and the typical PVD methods and applications in each. 

Industry	PVD Methods Used	Applications
Semiconductors	Magnetron Sputtering, Co-sputtering, E-beam	Wafer coating, MEMS, Thin-film deposition
Automotive	Magnetron Sputtering, Ion Plating	Engine parts, Coatings for wear resistance
Aerospace	Magnetron Sputtering, Ion Beam Deposition	Aerospace components, Surface activation
Medical Devices	Magnetron Sputtering, PECVD	Biocompatible coatings, Medical equipment
Optics	Magnetron Sputtering, E-beam, Co-sputtering	Anti-reflective coatings, Optical lenses
Tooling & Industrial	Sputtering, Ion Plating	Cutting tools, Wear-resistant coatings
Solar Panels	Magnetron Sputtering, PECVD	Thin-film solar cells, Transparent coatings

PVD technologies we deliver

At Novel Tec, the focus is on PVD solutions that provide a stable, repeatable process window for thin film deposition. Each PVD coating system is configured around suitable components, chamber concepts and recipes so that uniformity, adhesion and throughput can be matched to the customer’s requirements. To build trust, we communicate target specifications up front and review them together during trials and acceptance. Customers work directly with engineers who understand both the PVD process and the integration of the equipment into existing production lines, including handling, metrology, and service concepts.