Surfx Technologies
Atmospheric Argon Plasma Systems for High-Volume Manufacturing
In-line, damage-free surface cleaning for improved bonding and adhesion
What is Surfx atmospheric argon plasma?
Open air. No vacuum chamber. Several times faster than comparable vacuum-based methods.
Surfx atmospheric argon plasma is a surface preparation method that operates in open air, without a vacuum chamber. A controlled beam of reactive argon plasma removes microscale contamination, activates the surface for improved wetting and adhesion, and prepares it for downstream steps such as bonding, coating, sealing or encapsulation. Because the Surfx process runs at atmospheric pressure, it integrates directly into inline production and typically works several times faster than comparable vacuum-based methods.
What sets the Surfx technology apart is how gentle it is on sensitive parts. The plasma beam is 100 percent electrically neutral, with no streamers, no sparks, no electrostatic discharge (ESD), and virtually no particles or UV emission. As a result, it does not damage electrically sensitive integrated circuits or thermally sensitive polymers.
In semiconductor packaging, for example, the atmospheric hydrogen argon plasma removes oxidation from copper, tin silver alloy and indium micro bump arrays, enabling flux-free flip chip bonding. It is easy to integrate Atomflo plasma into your semiconductor process equipment – see our Surfx product range to find out more.
Why manufacturers choose atmospheric plasma
Runs in open air
No vacuum chamber, so the plasma step drops straight into an inline production flow.
100 % electrically neutral
No streamers, no sparks and no electrostatic discharge that could damage sensitive ICs.
Virtually particle-free
Almost no particles and very little UV emission during treatment.
Gentle on polymers
Safe for thermally sensitive plastics and delicate assembled parts.
Novel-Tec as Surfx integration partner in Europe
Novel-Tec represents Surfx Technologies in Europe and supports customers who need a controlled atmospheric plasma process inside a demanding production environment. We do not run coating or treatment services ourselves. Instead, we help you select the right Surfx plasma cleaner for your substrate, contamination profile and downstream process, configure it to your requirements, and support the integration into your existing production line.
1
Select
We evaluate which Surfx system fits your application, based on your substrate, your contamination profile and the process step that follows.
2
Integrate
We support the integration into your production line, together with you and the manufacturer, from first assessment to qualified operation.
3
Support
After installation, Novel-Tec continues to support you with service for your Surfx system.
Because we combine Surfx plasma solutions with our wider portfolio in surface treatment, automation and wet processing, we can plan the plasma step in the context of your complete process rather than in isolation. This makes Novel-Tec a single point of contact for selection, integration and long-term support.
Surfx systems at a glance
Surfx offers three automated plasma systems, each built for a different production scenario. The overview below helps you narrow down which system fits your application before looking at the full specifications.
STA-10
Automated plasma treatment for all other package formats and assembled parts.
STW-10
Automated plasma treatment for 300 mm wafers and dies on tape frames.
Atomflo INT
Plasma modules for integration directly into your own process equipment.
Applications by industry
Surfx atmospheric plasma is used across industries wherever clean, well-activated surfaces are critical.
Semiconductor and electronics
Surface preparation for advanced packaging and assembly:
- Silicon dioxide activation for hybrid bonding
- Metal oxide removal for flux-free micro bump bonding
- Surface activation for underfill, wire bond and molding
Aerospace and automotive
Reliable bonding and sealing of structural and electronic parts:
- Surface preparation of bonded structures and fasteners
- Surface activation prior to potting, sealing and gluing of components
Medical devices and diagnostics
Precise surface modification for sensitive components:
- Activation of catheters and stents for coating and bonding
- Controlled wetting for precision dispensing of biological media
Frequently asked questions
What is Surfx Technologies?
Surfx Technologies is a manufacturer of atmospheric plasma systems for surface cleaning and activation in high-tech manufacturing. Its systems are used in semiconductor packaging, electronics, aerospace, automotive and medical production. Novel-Tec represents Surfx Technologies in Europe.
What makes Surfx atmospheric plasma different from vacuum plasma?
Surfx atmospheric plasma works in open air without a vacuum chamber, so it can be integrated directly into inline production and typically works faster than vacuum based methods. This removes the need for a sealed vacuum system while still delivering clean, well activated surfaces.
What surfaces and materials can Surfx plasma treat?
Surfx atmospheric plasma is used on materials such as silicon wafers, metals, glass, polymers and composite structures. It is suitable for sensitive parts because the beam is electrically neutral and adds virtually no particles.
Which industries use Surfx plasma systems?
Surfx plasma systems are used in semiconductor packaging, electronics assembly, aerospace, automotive, and medical devices and diagnostics. Typical applications include hybrid bonding, flux free micro bump bonding, conformal coating, and the activation of catheters and stents.
Speak with our engineering team to solve your adhesion challenges.
Tell us about your substrate, your contamination profile and the step that follows. We will help you find the Surfx system that fits – and support you through integration and service.
CONTACT US
Novel Technology Transfer GmbH
Dorfstrasse 16
85235 Pfaffenhofen a.d. Glonn
Germany
Phone +49 (0)8134 55700-0
Fax +49 (0)8134 55700-10
Mail info@novel-tec.de
REQUEST A CALL